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Startseite » Products » Gluing&dispensing » Dosing technology

Dosing in gluing and potting processes

Precise, safe, future-oriented. Take your gluing and potting processes to a new level with Nagel: precise dispensing for the highest quality, stable and reproducible results – efficient, economical and perfectly tailored to your requirements.

Whether for sealant application, bonding with integrated joining or the encapsulation of electronics, batteries and electric motors: We offer you intelligent solutions that make your production safer, faster and fit for the future – and give you a decisive competitive edge.

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Nail – because bonding means more than just joining.

  • Safe joining of different materials without impairing their properties
  • Ideal for lightweight construction and weight reduction
  • Increased recyclability and circularity of the products
  • Additional functions such as sealing, insulation, electrical conductivity or targeted heat insulation and dissipation
  • Precise, reproducible processes for maximum quality and future-proofing

Nail – because protection and performance are inseparable.

  • Reliable protection of electronic circuits, printed circuit boards and components
  • Effective heat dissipation through solid-based cooling systems
  • Simultaneous fixing of components for maximum stability and durability